Component mounting board, process for producing the board, and process for producing the module

ABSTRACT

A parts-packaging substrate comprising a metal wiring plate having a mask coated on its surface with several openings. This structure eliminates the need for a thick base formed of an insulating body and a resist layer required in prior art substrates. By bending a terminal of the metal wiring plate to form a connecting terminal, a connector used to connect to another substrate can be eliminated, reducing the cost of manufacture.

FIELD OF THE INVENTION

The present invention relates to a parts-packaging substrate and amethod for manufacturing the same as well as a method for manufacturinga module.

BACKGROUND ART

Conventionally, a parts-packaging substrate a paper phenol substrate, acoppered laminate resin substrate such as paper phenol substrate andglass epoxy substrate, and a ceramic substrate or a metal substrate.FIG. 7 shows a structural example of the prior art.

In every case, a metal wiring layer 23 with a desired pattern appliedthereto is formed on the surface of an insulating substrate 22 and aresist layer 24 is formed on part of the surface of the metal wiringlayer 23 exposed so as to match the electrodes of electronic parts.

A method for manufacturing a coppered laminate resin substrate comprisesforming a desired pattern by the electrochemical etching to make a metalwiring layer after bonding a copper foil to the surface of an insulatingsubstrate 22 serving as a base. Then, resin serving as a resist layer 24is printed by using a screen mask or the like and hardened.

Material examples of the insulating substrate 22 are a paper-basedphenol resin impregnated substrate or a glass-textile-based epoxy resinimpregnated substrate. The copper foil is prepared by electrolysis androlling. The representative thickness is 0.2-1.6 mm for an insulatingsubstrate 22, 0.009-0.05 mm for a metal wiring layer 23 and 0.005-0.05mm for a resist layer 24.

In a method for manufacturing a metal substrate, aluminum or steel isused as an insulating base material 22, a copper layer is formed bysticking a copper foil on the surface or by plating after the insulatingtreatment of the surface, a metal wiring layer 23 subjected to a desiredpatterning by the electrochemical etching is formed and next a resistlayer 24 is formed by the printing.

The representative thickness is 0.4-2.0 mm for an insulating basematerial 22 serving as the base, 0.01-0.2 mm for a metal wiring layer 23and 0.005-0.05 mm for a resist layer 24.

A method for manufacturing a ceramic substrate comprises the steps ofprinting a paste onto a base material such as Al₂ O₃ in accordance witha desired pattern by using a screen mask which is prepared by kneadingmetal powder and glass powder with resin such as ethyl cellulose and asolvent such as terpineol as an insulating base material 22 serving as abase, evaporating or burning the resin and solvent by sintering at atemperature of 600-900° C., securing the remaining metal powder andglass powder on the base material by fusion or sintering to thus form ametal wiring layer 23 and then forming a resist layer 24.

The representative thickness is typically 0.5-1.5 mm for a ceramicsubstrate serving as the insulating base material 22 and 0.005-0.05 mmfor a metal wiring layer 23.

Since there is an insulating base material serving as the thick base forforming the metal wiring layer and a. resist layer, however, aconventional parts-packaging substrate as mentioned above problems thatthe manufacturing cost is high and is dependent on the price of aninsulating base material serving as the base.

In addition, the connection to another substrate present an additionalproblem in that it is necessary to join a connector terminal as anotherpart onto the parts-packaging substrate and then to connect thesubstrates to each other via the connector, increasing the total cost.

Thus, it is the object of the present invention. to provide aparts-packaging substrate which can be manufactured while omitting aninsulating base material serving as the base or by using a simplesubstrate base and which needs no other parts for connection with othersubstrates, a method for manufacturing the same, and a method formanufacturing a module.

SUMMARY OF THE INVENTION

A parts-packaging substrate according to an embodiment of the presentinvention comprises a metal wiring plate patterned so as to electricallyconnect the electrodes of a plurality of parts to each other and a maskfilm coated so as to cover the end face of the metal wiring plate inwhich openings corresponding to the electrodes of the parts are formed.

According to the above arrangement of a parts-packaging substrate, thebase substrate in a conventional example is unnecessary but the use of asimple mask film is only necessary.

A parts-packaging substrate according to another embodiment of thepresent invention comprises a metal wiring plate in a parts-packagingsubstrate wherein holes for inserting the lead electrodes of parts aremachined and a mask film coated on the side opposite to that ofinsertion of parts is formed with soldering openings of larger diametersthan the inside ones of the insertion openings at substantiallycorresponding positions to the insertion holes.

According to the above arrangement of a parts-packaging substrate, thebase substrate of the conventional example is unnecessary, and becausethe presently claimed invention discloses soldering, openings are formedin the coated mask film, soldering after the insertion of leadelectrodes in parts can also be implemented without hindrance.

A method for manufacturing a parts-packaging substrate according to thepresent invention comprises the steps of:

fabricating a metal wiring plate by partially removing the metal platechemically or physically into a desired pattern; coating the metalwiring plate with a mask film in which openings are providedcorresponding to the positions of mounting parts in the desired pattern;and fabricating a separated electrode part not electrically connected byremoving a part of the metal wiring plate after the coating of the maskfilm.

According to the above method for manufacturing a parts-packagingsubstrate, in a pattern for the electrical connection between aplurality of parts, the formation of a separated electrode notelectrically connected is indispensable to freely design a circuit or awiring pattern without restriction to applicable electronic circuit, andthe manufacturing of such separated electrode section can be easilyimplemented.

A method for manufacturing a parts-packaging substrate according to thepresent invention is a method according to wherein the mask film ispeeled off after the packaging and electrically connecting the parts.

According to the above method for manufacturing a parts-packagingsubstrate, a mask film to be peeled off is usable only for purposes ofproviding retention and fixation of the separated electrode till thepackaging of parts, and it is sufficient to select the material andcharacteristics fitted only for the purposes. Thus, by adopting a thinand inexpensive material, the obtained substrate becomes inexpensive.

A method for manufacturing a parts-packaging substrate according to ofthe present invention is a method further comprising the steps of:coating a mask film made up of a thermosetting resin prepreg to a metalwiring plate; removing at least one part of the metal wiring plate andpart of the mask film; and hardening the resin by heating the mask film.

According to the above method for manufacturing a parts-packagingsubstrate, it becomes possible to more firmly support and fix the metalwiring plate owing to the resin curing through aids of heating the maskfilm.

A method for manufacturing a parts-packaged module according to thepresent invention comprises the steps of: fabricating a mask film byperforating a continuous tape-shaped film; fabricating a metal wiringplate by press stamping a continuous tape-shaped metal plate;fabricating a continuous body of circuit substrates by coating the maskfilm and the metal wiring plate to each other; packaging and joiningparts onto the continuous body of circuit substrates; and separating aparts-packaged module from the continuous body.

According to the above method for manufacturing a parts-packagingmodule, an effect of productivity is enhanced by processing and coatingboth the metal wiring plate and mask film in the shape of a continuoustape, and an effect of greatly reducing the manufacturing cost isachieved by performing a packaging and joining of parts on thecontinuous circuit board and then separating it into individual boardsof the parts-packaged module.

A method for manufacturing a parts-packaged module according to thepresent invention comprises the steps of: placing and fixing individualmetal wiring plates patterned on a continuous tape-shaped film;conveyance-positioning and fixing by using holes or marks provided onthe continuous tape-shaped film; and packaging and joining parts on theindividual metal wiring plates.

According to the above method for manufacturing a parts-packagingmodule, the positioning fixation for conveyance is performed by using acontinuous tape-shaped film, so that the metal wiring plate can be of aminimum size and such spaces as for gripping, fixation, and holemachining or mark forming, which have conventionally been required forthe positioning fixation for conveyance, become unnecessary.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a parts-packaging substrateaccording to Embodiment 1;

FIGS. 2(a)-2(c) are sectional structural views showing a parts-packagingsubstrate according to Embodiment 1;

FIG. 3 is a sectional structural view showing a parts-packagingsubstrate according to Embodiment 2;

FIGS. 4(a)-4(d) show a manufacturing processes of a parts-packagingsubstrate according to Embodiment 2;

FIGS. 5(a)-5(b) are sectional structural views of a parts-packagingsubstrate showing a method for manufacturing the same according toEmbodiment 3;

FIGS. 6(a)-6(d) are sectional structural view showing the manufacturingprocess of a parts-packaging substrate according to Embodiment 4; and

FIG. 7 is a sectional structural view of a conventional parts-packagingsubstrate.

DISCLOSURE OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 1 to 6, the arrangement of a parts-packagingsubstrate and a method for manufacturing the same as well as a methodfor manufacturing a module will be described.

(Embodiment 1)

FIGS. 1 and 2 show Embodiment 1.

First, a parts-packaging substrate according to the embodiment shown inFIG. 1 and FIG. 2(a) comprises a metal wiring plate 1 subjected to apatterning by means such as press stamping or electrochemical etchingand a mask film 3, 4 coated to the surface of the metal wiring plate 1so as to cover the end face la of the metal wiring plate 1. On the maskfilm 3, openings 2 matching the electrodes of electronic parts areformed.

With the embodiment shown in FIG. 2(b), the mask film 4 is disposed onone face and openings 2 matching the electrodes of electronic parts areformed in the mask film 4.

With the embodiment shown in FIG. 2(c), the mask films 3, 4 are disposedon both faces of the metal wiring substrate 1 and openings 2 matchingthe electrodes of electronic parts are provided in both the mask films 3and 4.

Here, a 0.5±0.01 mm thick phosphor bronze plate was employed as themetal wiring plate 1 but the thickness is optional as being 0.05 mm, 0.2mm, 0.7 mm and 1.5 mm. Besides, needless to say, pure copper, 42 alloytin-plated steel plate, other various metals such as aluminum and theirsurface-treated materials can be used as a material.

Besides, for mask films 3, 4, paper-based polyamide-impregnated resinmade into a film is employed. The thickness of the film is 0.05 mm±0.015mm and adhesives are applied to one face side of the film for athickness of about 0.005 mm.

Like this, a metal wiring plate 1 subjected to a patterning by meanssuch as press stamping or electrochemical etching so as to electricallyconnecting the electrodes of electronic parts to each other assumes astructure that a mask film 3 is disposed on one face or a structure thatmask films 3, 4 are disposed on both faces, requiring no insulating base22 which has been required in a conventional example. Thus, use of onlya simple mask film is necessary.

Accordingly, manufacturing of parts-packaging substrates lower in costthan the conventional ones is facilitated. Furthermore, since the pressstamping can be utilized for the patterning of a metal wiring substrate1, a further cost reduction becomes possible and the productivity isalso high. Besides, forming of openings 2 in the mask films 3, 4 enablesthe packaging of electronic parts to be implemented, and coating a maskfilm 3 or mask films 3,4 so as to cover the end face of a metal wiringplate 1 eliminates a problem caused by external physical disturbance andsecures the insulation between wirings.

In FIGS. 1 and 2, the portion T protruding outward from the mask film 3,4 of the metal wiring plate 1 acts as terminal portion for theconnection to an external circuit when this parts-packaging substrate isused to make a parts-packaged module. When bent as required, thisportion T can be used in place of a connector terminal to the substrateto be packaged with a parts-packaging module, and can be connected to anexternal circuit without joining a connector terminal as a separateportion onto the parts-packaging substrate.

(Embodiment 2)

FIG. 3 shows Embodiment 2.

In a parts-packaging substrate according to Embodiment 2, a mask film 3is coated onto one face of a metal wiring plate 1 and holes 6 arepreviously machined in the metal wiring plate 1 so that lead electrodes9 of electronic parts 8 can be inserted therein. On the mask film 3,soldering openings 7 are formed corresponding to the holes 6 of themetal wiring plate 1, the diameter of the soldering openings 7 beinglarger than that of the holes 6. The prearranged direction of insertionof the lead electrodes 9 of electronic parts 8 is opposite to the coatedface of the mask film 3.

To be specific, machining has been made, setting the outside diameter ofthe lead electrode 9 as φ0.6±0.02 mm, the inside diameter of the hole 6as φ1.0±0.05 mm and the inside diameter of the soldering opening 7 asφ03.0±0.15 mm. Here, the material composition of the metal wiring plate1 and that of the mask film 3 are the same as those in Embodiment 1.

According to this parts-packaging substrate, the holes 6 for theinsertion of lead electrodes of electronic parts are machined in themetal wiring plate 1 and the coated face of the mask film 3 and theinserted face of electronic parts are opposed to each other inpositional relation, thus eliminating the need for an insulating base 22as in the conventional packaging substrate. Thus, a further reduction inthe costs of manufacturing of parts-packaging plates than theconventional is facilitated.

Besides, on the coated mask film 3, the soldering openings 7 having alarger diameter than the inside diameter of the holes 6 in the metalwiring plate 1 are formed, so that soldering after the insertion of thelead electrodes of electronic parts can be implemented withouthindrance.

This parts-packaging substrate shown in FIG. 3 is manufactured inaccordance with the manufacturing steps shown in 4(a)-4(b).Incidentally, in FIG. 3, the mask film 3 is illustrated with hatching.

First, a metal plate 10 as shown in FIG. 4(a) was stamped by using apress mold so as to make it into a desired pattern and a metal wiringplate 1 as shown in FIG. 4(b) was prepared.

Next, as shown in FIG. 4(c), a mask film 3 with openings 7 previouslyformed so as to match a desired pattern was coated onto the surface ofthe metal wiring plate 1. At that time, heat and pressure, each about70° C. and about 50 kgf/cm² were applied for about 10 minutes to promotethe close adhesion.

Then, to form a separated electrode 13 as shown in FIG. 4(d), the metalwiring plate 1 and the mask film 3 were partially stamped simultaneouslyby using a press mold at the position of a removal portion 12 of themetal wiring plate 1. Cutting is also possible by using CO₂ laser, aleutor or the like. As a result, the separated electrode portion 13 isso arranged as not to be connected to any metal wiring.

In a pattern to electrically connect the electrodes of a plurality ofelectronic parts, applicable electric circuits are not restricted, andin order to freely design circuits and wiring patterns, forming of aseparated electrode portion is indispensable. According to the abovemethod for manufacturing a parts-packaging substrate, there is providedan effect that such a separated electrode portion can be easilymanufactured. Accordingly, manufacturing of inexpensive and highlypractical parts-packaging substrates becomes possible.

Incidentally, the manufacturing method shown in FIG. 4 is effective notonly for manufacturing the parts-packaging substrate shown in FIG. 3 butalso for manufacturing any parts-packaging substrate shown in FIGS. 2(a)to 2(c).

(Embodiment 3)

FIG. 5 shows Embodiment 3.

This method for manufacturing a parts-packaging substrate ischaracterized in that a mask film 3 is peeled off from the metal wiringplate 1 after electronic parts are packaged and electrically connected.To be specific, in case of a parts-packaging substrate having mask films3 and 4 coated on both faces of the metal wiring plate 1 as shown in (a)of FIG. 5(a), after electronic parts 8a and 8b are placed on the metalwiring plate 1 of the parts-packaging substrate by using an adhesive 15and the electrodes are joined with soldering 14, the mask film 3 coatedon a face opposed to the packaged face of the electronic parts is peeledoff in the direction of the arrow X to make a parts-packaged module.

Similarly, as shown in FIG. 5(b), in case of a parts-packaging substratehaving a mask film 3 coated only on the face opposite to the packagingface of electronic parts in the metal wiring plate 1, after electronicparts 8c and 8d are placed on the metal wiring plate 1 of theparts-packaging substrate by using an adhesive 15 and the electrodes arejoined with soldering 14, the mask film 3 is peeled off in the directionof the arrow X.

According to this method for manufacturing a parts-packaging substrate,the mask film 3 peeled off after the packaging of electronic parts isused only to serve for the retention and fixation of a separatedelectrode portion 13 until the packaging is completed, and it issufficient to consider the purpose alone in selecting materials andproperties of the film. In other words, with a parts-packaging substrateaccording to each of the Embodiments 1 to 2 mentioned above, it wasnecessary for fulfilling the function as an electric circuit after thepackaging of portions that the mask film 3 be provided with electricallygood insulation, corrosion resistance and other characteristics, whereasnone of such characteristics is needed according to this method formanufacturing a parts-packaging substrate because the mask film ispeeled off and removed after the packaging of parts. Consequently,adopting a thin film of inexpensive material becomes possible and agreater cost-saving is achieved than according to Embodiments 1 and 2.

(Embodiment 4)

FIG. 6 shows Embodiment 4.

This method for manufacturing a parts-packaging substrate ismanufactured in accordance with the manufacturing steps shown in FIG.6(a)-6(d). In manufacturing a parts-packaging substrate according toeach of the Embodiments 1 to 3 mentioned above, a metal wiring plate 1subjected to a desired patterning as shown in FIG. 6(a) is prepared andthen a mask film 16 comprising a prepreg of thermosetting resin iscoated onto the metal wiring plate 1 as shown in FIG. 6(b).

As a mask film 16, a prepreg film impregnated with paper-based phenolresin is used. The film thickness is 0.2±0.03 mm and a mask film 16 iscoated onto the metal wiring film 1 under conditions of 80° C. and 10kgf/cm².

Other materials available for a mask film 16 include a paper-based epoxyresin-impregnated prepreg film and a glass texture epoxyresin-impregnated prepreg film, all of which do not injure the effect ofthe present invention at all.

Then, as shown in FIG. 6(c), part of the metal wiring plate 1 is stampedcollectively for each mask film 16 by using a female die 17 and astamping punch 18 to form a separated electrode 13 according toEmbodiment 2.

Next, as shown in FIG. 6(d), the metal wiring plate 1 and the mask film16 processed in FIG. 6(c) are interposed between a heater 19a built-inmale die 20a and a heater 19b built-in female die 20b, and heated,whereby the resin composing a mask film 16 is heat-hardened.Incidentally, this heating is executed with a cushion sheet 21interposed between the mask film 16 and the heating female die 20b undersome pressure, thereby improving adhesion of the mask film 16 to themetal wiring plate 1. The temperature and pressure of the heating maledie 20a and of the heating female die 20b was respectively set at 230°C. and 120 kgf/cm², and the resin was hardened under the peaktemperature and pressure for 3 hours.

The fabricated parts-packaging substrate indicated an insulatingresistance value of 1.5×10¹² 106 by a comb-shaped electrode of 1.54 mmpitch and an adhesion value of -1.35±0.33 kgf/cm² (tape peeling method)obtained by measuring an adhesion force of the mask film 16 to the metalwiring plate 1, thus providing satisfactory characteristics as aparts-packaging substrate for constituting an electronic circuitry.

According to this Embodiment where part of the metal wiring plate 1 andpart of the mask film 16 are removed, forming an opening in a portion ofthe mask film 16 corresponding to a separated electrode 13 or the likemay result in need only for the removal of part of the metal wiringplate 1 alone. Besides, there are some cases where a metal-free portionof the metal wiring plate 1 is stamped and only a part of the mask film16 is removed.

(Embodiment 5)

A method for manufacturing a parts-packaged module according to thisembodiment includes three methods for manufacturing a parts-packagingsubstrate respectively according to previously described embodiments,and is a method of consistently performing the packaging and joining ofelectronic parts to complete a product as the parts-packaged module.

Either the mask film 3 or the mask films 3 and 4 and the metal wiringplate 1 subjected to press stamping are both formed in the shape of acontinuous tape, and the boring of openings 2 and 7 and the like and thepress stamping of the metal wiring plate 1 enable execution of theconveyance, support, positioning and fixation in the shape of therespective continuous tapes.

Furthermore, a mask film is coated onto the metal wiring plate tofabricate a continuous body of metal wiring plates 1, next electronicparts are packaged and joined on the continuous body of circuitsubstrates, thereafter the metal portion and film part are stamped, cutand bent, whereby each individual parts-packaged module is separatedfrom the continuous body of circuit substrates and brought tocompletion.

In a conventional method according to which individual pieces, not in acontinuous body, are machined, a unit mechanism of conveyance, support,positioning and fixation, and the like is needed, whereas this methodfor manufacturing a parts-packaging module is based on the machining ofcircuit substrates in a state of the above-mentioned continuous body.Thus, according to the present invention, a manufacturing methodrequiring none of such unit mechanism can be implemented. Besides, amore rapid machining is facilitated than in the state of individualpieces and consequently the productivity rises. In any way, themanufacturing that permits cost-saving becomes possible.

And yet further, by the stamping in separation and bending in cutting,the respective connection portions between metal portions and metalwiring plates in the shape of a continuous tape are machined into ashape usable as connection terminals to other substrates, so that theeffect of needing no other portions such as connector portions areobtained and consequently a further cost-saving can be achieved.

Incidentally, in manufacturing a final parts-packaged module having maskfilms 3 and 4 coated onto the metal wiring plate 1, as shown in FIG.2(a) and 2(c), it is possible to choose either a manufacturing method inwhich both mask films 3 and 4 are made into the shape of a continuoustape and coated onto the continuous tape-shaped metal wiring plate 1interposed between these continuous tape-shaped mask films 3 and 4, or amanufacturing method in which one of the mask films 3 and 4, e.g., themask film 4, is made into the shape of a continuous tape, and the otherone, i.e., the mask film 3 in this case, is made into individual filmpieces for each parts-packaged module, and then these individual filmpieces are coated onto one face of a continuous tape-shaped wiring plate1 having a continuous tape-shaped mask film 4 coated on the other face.

(Embodiment 6)

A method for manufacturing a part-packaged module is not described,wherein a metal wiring plate is made into individual pieces and acontinuous tape-shaped mask film uses individual pieces of the metalwiring plate as carriers for conveyance, positioning and fixation. Inmachining a metal wiring plate made into the shape of a continuous tape,blank portions for conveyance, positioning and fixation becomenecessary. Since the metal wiring plate is higher in material cost thanthe mask film, blank portions are provided in the mask film and themetal wiring plate is individualized so as to enable the area and thematerial procurement to be minimized. Thus, a low-cost manufacturing ismade possible.

To be specific, in manufacturing a final parts-packaged module having amask film 4 coated onto one face of the metal wiring plate 1 as shown inFIG. 2(b), individualized pieces of the metal wiring plate 1 are placedat predetermined intervals and coated onto a continuous tape-shaped maskfilm 4, electronic parts are packaged and joined and thereafter everyparts-packaged module is separated. In this case, it is possible toselect either one of the following methods: a method of stamping,cutting and bending the metal wiring plate 1 and the mark film 4, andseparating them into individual parts-packaged modules; or a method ofstamping, cutting and bending only the mask film 4, and separating itinto individual parts-packaged modules.

When a parts-packaged module finished by coating the mask films 3 and 4on the metal wiring plate 1 is to be manufactured as shown in FIGS. 2(a)and 2(c), it is possible to choose either a manufacturing method bycoating mask films 3 and 4 onto individualized metal wiring plate pieces1 interposed at predetermined intervals between these continuoustape-shaped mask films 3 and 4, packaging and joining electronic partsand thereafter separating every parts-packaged module, or amanufacturing method by placing individualized metal wiring plate pieces1 at predetermined intervals on a continuous tape-shaped mask film 4,further cover it with film pieces of the mask film 3 for eachparts-packaged module portion to coat the mask films 3 and 4 onto themetal wiring plate 1, packaging and joining electronic parts thereon andthereafter separating each parts-packaged module. In this case, it ispossible to choose either a manner in which every parts-packaged moduleis separated after stamping, cutting or bending the metal wiring plate 1and a mask film 3 or mask films 3 and 4, or a manner in which everyparts-packaged module is separated after stamping, cutting or bendingmask films 3 and 4 or a continuous tape-shaped mask film 4 alone.

Industrial Applicability

As described above, a parts-packaging substrate and a method formanufacturing the same as well as a method for manufacturing aparts-packaged module according to the present invention are veryeffective to simplify the manufacturing steps and to realize costsavings of manufacturing a parts-packaging substrate or a parts-packagedmodule by using the parts-packaging substrate.

What is claimed is:
 1. A parts-packaging substrate comprising:a metalwiring plate patterned to electrically connect electrodes of a pluralityof parts; and a mask film covering a surface of said metal wiring plate,wherein said mask film has openings corresponding only to a plurality ofpositions for mounting the electrodes of the plurality of parts.
 2. Aparts-packaging substrate according to claim 1, wherein said metalwiring plate has a plurality of holes therein for inserting saidelectrodes from the plurality of parts, said mask film covers a lowersurface of said wiring plate opposite a top surface of said wiring plateon which said plurality of parts are mountable;wherein said openings areadapted to receive solder and have a diameter larger than the holes insaid metal wiring plate, and locations of said openings correspond topositions of said holes.
 3. A method for manufacturing a parts-packagingsubstrate comprising:partially removing a portion of a metal plate by atleast one of a chemical and physical process into a desired pattern tofabricate a metal wiring plate; coating said metal wiring plate with amask film, said mask film including openings corresponding only to aplurality of positions for mounting a plurality of parts in said desiredpattern; and removing a portion of said metal wiring plate and acorresponding portion of said mask film to provide a separated electrodepart not electrically connected with the plurality of parts.
 4. A methodfor manufacturing a parts-packaging substrate according to claim 3,further comprising the steps of packaging and electrically connectingthe plurality of parts onto a packaging substrate, andpeeling off saidmask film from said metal wiring plate after packaging and electricallyconnecting the plurality of parts onto the packaging substrate.
 5. Amethod for manufacturing a parts-packaging substrate according to claim3, further comprising:coating a mask film of a thermosetting resinprepeg on to said metal wiring plate; and hardening the thermosettingresin by heating said mask film.
 6. A method for manufacturing aparts-packaged module comprising:fabricating a mask film by perforatinga continuous tape-shaped film to form openings corresponding to aplurality of positions for mounting electrodes of parts; fabricating ametal wiring plate by press stamping a continuous tape-shaped metalplate; fabricating a continuous body of circuit substrates by coatingsaid metal wiring plate with said mask film so as to match the mask filmopenings with the positions for mounting the electrodes; packaging andjoining parts onto said continuous body of circuit substrates; andseparating a parts-packaged module from said continuous body.
 7. Amethod for manufacturing a parts-packaged module comprising:placing andfixing individual metal wiring plates patterned onto a continuoustape-shaped film; conveyance-positioning and fixing parts to be packagedby placing said parts on at least one of holes and marks provided onsaid continuous tape-shaped film; and packaging and joining parts onsaid individual metal wiring plates.